• Location： Singapore

Date:  Sep 27, Oct 25, Nov 29, Dec 20
Address: 31 Kaki Bukit Rd 3 Techlink #05-20/3 S 417818
Time: 10am – 2pm

Expected Achievement for Participant

• Capability to Save Cost by Reducing Wastage

• Enhance Customer Satisfaction thru Better Product Quality

• Improve Response thru Shorten Cycle Time

• Use Industry Proven Tool to help Create More Innovative Products

Agenda

• Mold Design Process & Innovation

• Mold Simulation to Improve Time to Market and Product Quality

• Industry Best Practice & Case Studies Presentation

• Round Table Discussion

• Hands-on Test Drive

Contact

emilywu@moldex3d.com   / emilyoyk@hitachi-sunway-is.com