Product Portfolio and Features
● Essential features contained ○ Optional features
| Standard Package |
Solver Capabilities
|
|
| Parallel Processing |
8 |
| Transfer Molding |
● |
| Simulation Capabilities |
|
| Flow |
● |
| Cure |
● |
| Warp |
● |
| Thermal |
● |
| Stress |
● |
| Wire Sweep |
● |
| Paddle Shift |
● |
| Pre/Post Processors |
|
| Mesh |
● |
| Auto-hybrid |
○ |
| Cadence Interface |
○ |
| Designer |
● |
| Project |
● |
| FEA Interface |
● |
| Molding Process |
Compression Molding (CM)
|
|
| Compression Molding |
○ |
| No Flow Under Fill (NUF) |
○ |
| Embedded Wafer Level Package (EWLP) |
○ |
| Underfill |
|
| Capillary Under Fill (CUF) |
○ |
| Molded Underfill (MUF) |
○ |
| Potting |
|
| Potting |
○ |
| Post Mold Cure (PMC) |
|
| Chemical shrinkage of material |
○ |
| Viscoelasticity stress relaxation |
○ |
| Material Test |
| General Molding Process 1 |
|
| Viscosity (Rheometer) |
○ |
| Curing Kinetics (DSC) |
○ |
| Special Molding Process 2 |
|
| Specific Volume (PVTC) |
○ |
| Visco-elastics Modulus (DMA) |
○ |
| Contact Angle |
○ |
System Requirements
A. Supported Platform
| Platform |
OS |
| Windows |
Windows 10, Windows 8, Windows 7, Server 2019, Server 2016, Server 2012 R2 |
B. Hardware Recommendation
| Minimum |
| CPU |
Intel® Core i7 Sandy Bridge series processor |
| RAM |
16 GB RAM, and at least 1 TB free space |
| Recommended |
| CPU |
Intel Xeon Platinum 8000 series processor |
| RAM |
64 GB RAM & 4 TB free space HDD, NVIDIA Quadro & AMD Radeon series graphic card and 1920 x 1080 screen resolution |
