Product Portfolio and Features
● Essential features contained ○ Optional features
Standard Package |
Solver Capabilities
|
|
Parallel Processing |
8 |
Transfer Molding |
● |
Simulation Capabilities |
|
Flow |
● |
Cure |
● |
Warp |
● |
Thermal |
● |
Stress |
● |
Wire Sweep |
● |
Paddle Shift |
● |
Pre/Post Processors |
|
Mesh |
● |
Auto-hybrid |
○ |
Cadence Interface |
○ |
Designer |
● |
Project |
● |
FEA Interface |
● |
Molding Process |
Compression Molding (CM)
|
|
Compression Molding |
○ |
No Flow Under Fill (NUF) |
○ |
Embedded Wafer Level Package (EWLP) |
○ |
Underfill |
|
Capillary Under Fill (CUF) |
○ |
Molded Underfill (MUF) |
○ |
Potting |
|
Potting |
○ |
Post Mold Cure (PMC) |
|
Chemical shrinkage of material |
○ |
Viscoelasticity stress relaxation |
○ |
Material Test |
General Molding Process 1 |
|
Viscosity (Rheometer) |
○ |
Curing Kinetics (DSC) |
○ |
Special Molding Process 2 |
|
Specific Volume (PVTC) |
○ |
Visco-elastics Modulus (DMA) |
○ |
Contact Angle |
○ |
System Requirements
A. Supported Platform
Platform |
OS |
Windows |
Windows 10, Windows 8, Windows 7, Server 2019, Server 2016, Server 2012 R2 |
B. Hardware Recommendation
Minimum |
CPU |
Intel® Core i7 Sandy Bridge series processor |
RAM |
16 GB RAM, and at least 1 TB free space |
Recommended |
CPU |
Intel Xeon Platinum 8000 series processor |
RAM |
64 GB RAM & 4 TB free space HDD, NVIDIA Quadro & AMD Radeon series graphic card and 1920 x 1080 screen resolution |