- Date：Sep 03, 2013
- Location： Penang, Malaysia
Expected Achievement for Participant
- Understanding 3D packaging simulation
- Capability to diagnose common challenges and solutions in 3D packaging
- Understanding basic concepts of compression molding
Agenda
| Time | Session |
| 09:30 – 10:30 | Design and Application Trend of 3D Package Stacking Technology |
| 10:40 – 11:30 | Challenges of 3D IC Package Region |
| 11:30 – 12:30 | First-Hand Experiences at Moldex3D Compression Molding |
Location
Penang, Malaysia
Contact
emilywu@moldex3d.com / satish@ftdsolutions.com