• Date：Oct 30, 2024
• Location： Online

10:00 AM CET / 2:30 PM IST | Wednesday, October 30, 2024 | Check Your Time

Registration Deadline: ONE DAY BEFORE THE WEBINAR.
The join link will not be provided to the registration on the webinar day.

Using PU (polyurethane), silicone, or epoxy for electronic potting offers advantages such as high insulation performance, protection of electronic components, and enhanced filling and sealing capabilities. In addition, electronic potting significantly improves electronic parts or products’ reliability, durability, and safety.

However, the potting process faces challenges like air trapping, thermal effects of phase transition, and residual stress caused by chemical shrinkage. These factors can impact the product lifespan and the estimates of reliability. This webinar will offer a comprehensive overview of the challenges in electronic potting. Our speaker will explore the latest technological trends in potting processes and introduce Moldex3D Electronic Potting’s digital twin solution.

What You Will Learn

• The Fundamentals of Electronic Potting
• Common Defects in Electronic Potting
• The Benefits of Moldex3D Electronic Potting