• Date：Apr 06, 2016 - Apr 09, 2016
• Location： Bangalore, Karnataka, India
• Booth Number：Hall 2A, C21 & C22
• Official Website：https://www.diemouldindia.org/

Moldex3D is proud to announce that we will be present at Die & Mould India International Exhibition in Bangalore, India from April 6th to April 9th. Along with our long-time partner in India, EUC TECH, we will demonstrate our latest simulation capabilities and share successful case studies of using Moldex3D’s solutions in solving plastic product design and manufacturing issues throughout the duration of the Show at Booth: Hall 2A, C21 & C22.

Moldex3D’s Senior Research Engineer, Dr. Joe Wang who has years of experience in Polymer Chemistry and Processing field will be present at our booth to answer any questions you may have.

Feel free to send in any inquiries or questions to us before, during, or after the Show at sales.in@moldex3d.com.

See you at this year’s Die & Mould India International Exhibition!

Venue

Bangalore International Exhibition Centre (BIEC)

Event Contact

• S.Srinivasa Raghavan
  sraghavan@euctech.com
• Suresh P
  suresh_p@moldex3d.com

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