- Date：May 29, 2014 - Jun 05, 2014
- Location： India
This year’s India Siemens PLM Connection will be held in three metropolitan India cities: Bangalore, New Delhi and Pune on May 29th , June 3rd , and June 5th, respectively. Moldex3D is proud to announce our returning status to the prestigious India’s Siemens yearly community event. We will participate in all three events and our Regional Manager, Mr. Nick Chang will have a presentation in the forenoon session, focusing on introducing NX™ EasyFill Analysis and the integration of Moldex3D technologies with Siemens products.
In addition to the presentation, you are invited to stop by our booth and have a chat with our friendly Moldex3D staff. Our staff members are equipped with the professional knowledge of 3D plastic injection simulation technology and years of experience of helping customers finding the most feasible solutions for their manufacturing problems. Don’t hesitate to bring your questions to our staff or just simply stop by and say hi!
We’re looking forward to meeting with the Siemens community in India!
For any questions, please contact our Regional Manager, Mr. Nick Chang at nickchang@moldex3d.com. Thank you!
Date & Location
May 29 at Bagnalore (Taj West End)
June 3 at New Delhi (Shangri-La)
June 5 ate Pune (Le Meridien)
Moldex3D
Moldex3D is the world leading CAE product for the plastic injection molding industry. With the best-in-class analysis technology, Moldex3D can help you carry out in-depth simulation of the widest range of injection molding processes and to optimize product designs and manufacturability.
NX™ EasyFill Analysis
NX™ EasyFill Analysis, powered by Moldex3D, is an integrated mold flow simulation tool for designers to easily check potential manufacturing defects without leaving the NX design environment. It helps users tackle significant molding issues more efficiently to optimize gate number/locations, material selection, or process conditions.