- Location： Singapore
CoreTech System (Moldex3D) is going to bring to this worldwide series of “Molding Innovation Day” events to Singapore. The event will take place on the 30th of October, 2013. This meeting is designed to help Moldex3D users and prospects i to get the understanding of application of Moldex3D R12 product.
Agenda
|
Time |
Agenda |
Speaker |
|
9:30-10:00 |
Registration |
|
|
10:00-10:10 |
Opening remark |
Hitachi-Sunway |
|
10:10-10:50 |
Technical Presentation: Moldex3D R12 on Advanced Process Technology |
CoreTech System (Moldex3D) |
|
10:50-11:20 |
Break |
|
|
11:20-12:10 |
Technical Presentation: Live Demo – Moldex3D Latest Technology on Fiber and Multiple Component Molding |
CoreTech System (Moldex3D) |
|
12:10-12:20 |
Q&A / Closing Remark |
Hitachi-Sunway |
Event Venue
Hitachi Sunway Information Systems – Singapore
31 Kaki Bukit Road 3
#05-20/23 Techlink Lobby A
Singapore 417818
Registration & Contact Information
Emily Ong Ying Kiat
Tel: +65 6319 4888
Fax: +65 6319 4880
DID: +65 6319 4875
Email: emilyoyk@hitachi-sunway-is.com