- Location： Kuala Lumpur, Malaysia
CoreTech System (Moldex3D) is going to bring to this worldwide series of “Molding Innovation Day” events to Kuala Lumpur, Malaysia. The event will take place on the 30th of October, 2013. This meeting is designed to help Moldex3D users and prospects in Automotive Industry to get the understanding of application of Moldex3D products on automotive part/mold design.
Agenda
|
Time |
Agenda |
Speaker |
|
9:30-10:00 |
Registration |
|
|
10:00-10:10 |
Opening remark |
Hitachi-Sunway |
|
10:10-10:50 |
Technical Presentation: Moldex3D Reshapes the Automotive Design – Our US Experience |
CoreTech System (Moldex3D) |
|
10:50-11:20 |
Break |
|
|
11:20-12:10 |
Technical Presentation: Key Technologies of Novel Automotive Molding Process |
CoreTech System (Moldex3D) |
|
12:10-12:20 |
Q&A / Closing Remark |
Hitachi-Sunway |
Event Venue
Hitachi Sunway Information Systems – Malaysia
Unit 2.4, 2nd Floor
Surian Tower, No: 1, Jalan PJU 7/3, Mutiara Damansara
47810 Petaling Jaya, Selangor, Malaysia
Registration & Contact Information
Jason Kok
DID: +03 7717 3833
Fax: +03 7717 3889
Mobile: +017 668 8736
Email: jasonkjs@sunway.com.my