Moldex3D Users’ Meeting 2009 will be held in Seoul, Korea. The meeting will he held on 21st October from 10:00 to 17:00 in the Meeting Room 2, JW-Marriott Hotel.
Professor Lee B. O of Aju University, Korea will be giving the key notes to open the conference and the president of Moldex3D, Dr. Venny Yang will start the presentation with an introduction to Moldex3D R10.0—Moldex3D’s latest innovations.
Several renowned Korean companies recovered the severe economic crises rapidly by implanting the use of the pioneer 3-D injection molding simulation software—Moldex3D. Without Moldex3D these companies might not be able to recover from the great economic loss so rapidly by enhancing productivity and speeding the product cycle, which also greatly contributed to the company’s cost-down strategy.
Thus, in the afternoon, successful stories of companies who benefited from implanting the use of Moldex3D software will be shared by Mr. Yoon G. H. from Raygen with the topic “ER-Mold Analysis Using Moldex3D”, Mr. Park N. J. from Samsung Electronics will share with the topic”Fix Corrosion Problem of Refrigerator Using Moldex3D”. Successful stories from Korea Engineering Plastics (KEP) titled “Structural Analysis Applied Fiber Orientation Effect from Moldex3D”, Honam-Petro Chemical’s “Back Light Unit Analysis Using Moldex3D” will also be presented accordingly by Mr. Yoon C. J.and Mr. Lee J. W.
As to the successful stories of Moldex3D’s simulation of encapsulation of IC packaging from Korean leading semiconductor groups, Mr. Lee B. D. from Hynix will present “Matrix Lead Frame TSOP Type Analysis with Moldex3D”, and Mr. Lee S. S. from TSP will present “CAE Analysis of Non-Fill and Wire Sweep in Microelectric Packaging”
To close the conference, ETS soft will demonstrate Moldex3D’s latest version—Moldex3D R10.0 (scheduled to be released on 2010) to share with all the participants the latest innovation of Moldex3D.
Today, companies tend to seek alternative strategies to overcome the harsh economic environment. Through Moldex3D Users’ Conference 2009 in Korea, participants worldwide shall have the chance to experience Moldex3D’s latest innovation, exchange ideas with CAE professionals, and share the successful stories with using Moldex3D—The true 3-D injection molding simulation software.
We are looking forward to your participating in Moldex3D Users’ Meeting 2009 and please visit www.moldex3d.com or contact mail@moldex3d.com for more information.
Agenda
- Date: 21st Oct. 2009
- Event title Moldex3D User’s Conference, Korea, 2009
- Location:JW-Marriott Hotel, Seoul, Korea
| Time | Title | Presented By |
| 09:30 – 10:00 | Registration | – |
| 10:00 – 11:00 | Key Notes | Aju University – Prof. Lee B.O |
| 11:00 – 12:00 | Introduction to Moldex3D R10.0 | Moldex3D – Mr. Venny Yang |
| 12:00 – 13:00 | Lunch Time | – |
| 13:00 – 13:30 | ER-Mold Analysis using Moldex3D | Raygen – Mr. Yoon G.H. |
| 13:30 – 14:00 | Fix corrosion problem of refrigerator using Moldex3D |
SAMSUNG Electronics Home Appliances Div. – Mr. Park N.J. |
| 14:00 – 14:30 | Matrix Lead Frame TSOP Type Analysis | Hynix – Mr. Lee B.D. |
| 14:30 – 14:50 | Coffee Break | – |
| 14:50 – 15:20 | Structural Analysis applied Fiber Orientation effect from Moldex3D | KEP – Mr. Yoon C.J. |
| 15:20 – 15:50 | Back Light Unit Analysis using Moldex3D |
Honam-Petro Chemical – Mr. Lee J.W. |
| 15:50 – 16:20 | CAE Analysis of Non-Fill and Wire-Sweep in Microelectric Packaging | TSP – Mr. Lee S.S. |
| 16:20 – 16:40 | Coffee Break | – |
| 16:40 – 17:00 | Moldex3D R10.0 Demo | ETS-Soft. – Mr. Min S.H. |
| 17:00 – 17:30 | Closing | – |